Home / Inventions / Heat Transfer & Evaporation / Cooler

Patent pending

A liquid cooler with no heat-transfer surface

Picture heat rejection with nothing to foul, nothing to scale, and a smaller footprint per kW than a dry cooler — because there is no heat-transfer surface. The liquid is cooled by direct turbulent contact with air, returns at full volume, and the exhaust leaves heated, not humidified.

  • Nothing to foul, nothing to scale. No fixed surface exists in the exchange zone — the failure mode of conventional coolers is removed, not managed.
  • Smaller footprint per kW than dry coolers.
  • The liquid comes back — all of it. Full-volume return; no evaporative loss, no drift, no makeup water.
  • Dry, warm exhaust. The air leaves heated, not humidified.
  • Operating envelope: cooling air up to ~30 °C, liquid up to ~45 °C — the data center regime.

Where it fits: data center heat rejection, industrial process cooling, and any circulating loop where fouling, water consumption, or footprint is the constraint. A direct-contact architecture that complements sealed-surface heat exchange rather than competing with it.

In the family: the Cooler also serves as the heat-relief stage of the facility-integrated systems described under Systems & Combinations.

US provisional application filed (patent pending). Mechanism, full specification, and drawings under NDA.

Request the cooler NDA package